Semiconductor device and method for making the device
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorHiroki MIYAJIMA
Life of this patent
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Abstract
Disclosed herein is a semiconductor device including: a first substrate provided with a first surface layer including a first electrode; an expanded second substrate provided with a second surface layer including a second electrode and directly bonded to the first substrate so that the second surface layer contacts with the first surface layer; and a through electrode running through the first or second substrate. The second surface layer is provided over an expanded second principal surface defined by a second substrate and a resin portion. The second substrate has a smaller planar size than the first substrate. The first and second electrodes are connected together and in contact with each other.
Claims9
A semiconductor device comprising
- a first substrate having a first principal surface on which circuit components are provided and over which a first surface layer, including a first electrode, is provided,
- an expanded second substrate including:
- a second substrate having a second principal surface on which circuit components are provided;
- a resin portion provided on a side surface of the second substrate;
- and a second surface layer which is provided over an expanded second principal surface defined by the second substrate and the resin portion surrounding the second substrate and which includes a second electrode, the expanded second substrate being directly bonded to the first substrate such that the second surface layer contacts with the first surface layer, and
- a through electrode which either is connected to the first electrode and runs through the first substrate or is connected to the second electrode and runs through the second substrate, wherein
- the second substrate has a smaller planar size than the first substrate, and
- the first and second electrodes are connected together and are in contact with each other.
Dependencies are inferred from the claim text.