Semiconductor package and method of fabricating the same
AssigneeSamsung Electronics Co., Ltd.
InventorsJunyeong HEO, CHAJEA JO, Taeje CHO
Life of this patent
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Abstract
An embodiment includes a semiconductor package comprising: a substrate; a first semiconductor chip mounted on the substrate; a second semiconductor chip mounted on a top surface of the first semiconductor chip; a connecting bump disposed between the first and second semiconductor chips to electrically connect the second semiconductor chip to the first semiconductor chip; and a first heat dissipation part disposed on the top surface of the first semiconductor chip between the first and second semiconductor chips and spaced apart from a bottom surface of the second semiconductor chip.
Claims18
A semiconductor package comprising:
- a substrate;
- a first semiconductor chip mounted on the substrate;
- a second semiconductor chip mounted on a top surface of the first semiconductor chip;
- a connecting bump disposed between the first and second semiconductor chips to electrically connect the second semiconductor chip to the first semiconductor chip;
- and
- a first heat dissipation part disposed on the top surface of the first semiconductor chip between the first and second semiconductor chips and spaced apart from a bottom surface of the second semiconductor chip.
A semiconductor package comprising:
- a substrate;
- a first semiconductor chip disposed on the substrate;
- a second semiconductor chip disposed on the first semiconductor chip;
- a connecting bump disposed between the first and second semiconductor chips to electrically connect the second semiconductor chip to the first semiconductor chip;
- a first pad disposed between the first semiconductor chip and the connecting bump;
- and
- a heat dissipation part disposed on the top surface of the first semiconductor chip between the first and second semiconductor chips and spaced apart from a bottom surface of the second semiconductor chip, wherein the first heat dissipation part includes a second pad.
18-20. (canceled)
Dependencies are inferred from the claim text.