US 2016/0079207 A1Published application

Semiconductor device and method for manufacturing same

AssigneePS4 Luxco S.a.r.l.

InventorsMasahiro Yamaguchi, Toro Saga, Koji Hosokawa

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Abstract

[Problem] To provide a semiconductor device suitable for use as an upper-side package of a semiconductor device having a PoP structure. [Solution] This invention is provided with a semiconductor chip (10) flip-chip mounted on one surface (32) of a wiring board (30), and a semiconductor chip (20) flip-chip mounted on the other surface (33) of the wiring board (30), the semiconductor chips (10, 20) being installed in directions that differ by 90°. It is thereby possible to prevent the layout of wiring patterns (41, 42) on the wiring board (30) from becoming locally congested and enhance the freedom of layout. In addition, when the semiconductor chips (10, 20) are mounted on the wiring board (30), the location at which the load concentrates can be held by a stage, thereby making it possible to prevent the wiring board from deforming.

Claims15

Dependent claims

A semiconductor device comprising:

a wiring board having a plurality of first connection pads formed on a first surface, a plurality of second connection pads formed on a second surface, and a plurality of lands which are disposed on the second surface and are electrically connected to the first or second connection pads;
a first semiconductor chip having a first surface defined by opposing first and second ends and opposing third and fourth ends, and a plurality of first bump electrodes which are disposed along the first and second ends on the first surface, said first semiconductor chip being mounted on the first surface of the wiring board in such a way that the plurality of first bump electrodes are connected to the plurality of first connection pads;
a first sealing resin which is formed on the first surface of the wiring board in such a way as to cover the first semiconductor chip;
a second semiconductor chip having a first surface defined by opposing first and second ends and opposing third and fourth ends, and a plurality of second bump electrodes which are disposed along the first and second ends on the first surface, said second semiconductor chip being mounted on the second surface of the wiring board in such a way that the plurality of second bump electrodes are connected to the plurality of second connection pads and in such a way that the first and second ends of the second semiconductor chip are disposed parallel to the third and fourth ends of the first semiconductor chip;
a second sealing resin which is formed on the second surface of the wiring board in such a way as to cover the second semiconductor chip;
a plurality of conductive posts which are provided running through the second sealing resin and are connected at a first end to each of the plurality of corresponding lands while a second end thereof is exposed from the second sealing resin;
and
a plurality of solder balls which are mounted at the second end of the plurality of conductive posts.

5 more elements

A method for manufacturing a semiconductor device, comprising:

forming a plurality of first connection pads on a first surface of a wiring board, and forming a plurality of second connection pads, a plurality of lands which are electrically connected to the first or second connection pads, and a plurality of conductive posts which are connected at a first end to each of the corresponding plurality of lands, on a second surface of the wiring board;
mounting a first semiconductor chip having a first surface defined by opposing first and second ends and opposing third and fourth ends, and a plurality of first bump electrodes disposed along the first and second ends of the first surface on the first surface of the wiring board in such a way that the plurality of first bump electrodes are connected to the plurality of first connection pads;
mounting a second semiconductor chip having a first surface defined by opposing first and second ends and opposing third and fourth ends, and a plurality of second bump electrodes disposed along the first and second ends of the first surface on the second surface of the wiring board in such a way that the plurality of second bump electrodes are connected to the plurality of second connection pads and in such a way that the first and second ends of the second semiconductor chip are disposed parallel to the third and fourth ends of the first semiconductor chip;
forming first and second sealing resins on the first and second surfaces, respectively, of the wiring board in such a way as to cover the first and second semiconductor chips;
grinding the second sealing resin in such a way that a second end of the plurality of conductive posts is exposed;
and
mounting a plurality of solder balls at the second end of the plurality of conductive posts.

4 more elements

Dependencies are inferred from the claim text.