Semiconductor package assembly
AssigneeMediatek Inc.
InventorsTzu-Hung LIN, I-Hsuan PENG, Ching-Wen HSIAO
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Abstract
The invention provides a semiconductor package, a semiconductor package assembly and a method for fabricating a semiconductor package. The semiconductor package assembly includes a first semiconductor package. The first semiconductor package includes a first semiconductor die having first pads thereon. A first redistribution layer (RDL) structure is coupled to the first semiconductor die. Conductive pillar structures are disposed on a surface of the first RDL structure away from the first semiconductor die, wherein the conductive pillar structures are coupled to the first RDL structure.
Claims27
A semiconductor package assembly, comprising:
- a first semiconductor package, comprising:
- a first semiconductor die having first pads thereon;
- and
- a first redistribution layer (RDL) structure coupled to the first semiconductor die;
- and
- conductive pillar structures disposed on a surface of the first RDL structure away from the first semiconductor die, wherein the conductive pillar structures are coupled to the first redistribution layer (RDL) structure.
A method for fabricating a semiconductor package, comprising:
- disposing a semiconductor die on a carrier, wherein the semiconductor die has conductive vias on a top surface of the semiconductor die, which is positioned away from the carrier, wherein the conductive vias are coupled to the die pads of the semiconductor die;
- applying a molding compound to the carrier to form a molded substrate;
- forming a redistribution layer (RDL) structure on the molding compound and coupled to the semiconductor die;
- forming a conductive pillar structures on and coupled to of the RDL structure;
- and
- removing the carrier from a back surface of the semiconductor die.
A semiconductor package, comprising:
- a first semiconductor die having first pads thereon;
- a first redistribution layer (RDL) structure coupled to the first semiconductor die;
- and
- conductive pillar structures disposed on a surface of the first RDL structure away from the first semiconductor die, wherein the conductive pillar structures are coupled to the first RDL structure.
Dependencies are inferred from the claim text.