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US 2016/0079201 A1Published application
Method of manufacturing a semiconductor device
AssigneeAmkor Technology, Inc.
InventorsWon Chul Do, Jin Hee Park
Life of this patent
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Abstract
A method for manufacturing a semiconductor device, for example formed utilizing component stacking. As non-limiting examples, various aspects of this disclosure provide a method for reducing warpage and/or stress in stacked semiconductor devices.
Claims20
A method of manufacturing a semiconductor device, the method comprising:
- attaching an interposer to a substrate utilizing a first reflow process;
- after said attaching an interposer, attaching a semiconductor die to the interposer utilizing a second reflow process;
- after said attaching a semiconductor die to the interposer, forming a first underfill between the interposer and the substrate, and forming a second underfill between the semiconductor die and the interposer;
- and
- after said forming a first underfill and said forming a second underfill, curing the first and second underfills.
2 more elements
A method of manufacturing a semiconductor device, the method comprising:
- attaching an interposer to a substrate utilizing a first reflow process, wherein after said attaching an interposer, the interposer is warped a first amount;
- after said attaching an interposer, attaching a semiconductor die to the interposer utilizing a second reflow process, wherein after said attaching a semiconductor die, the interposer has less warpage than the first amount;
- and
- after said attaching a semiconductor die to the interposer, forming a first underfill between the interposer and the substrate, and forming a second underfill between the semiconductor die and the interposer.
1 more element
A method of manufacturing a semiconductor device, the method comprising:
- attaching an interposer to a substrate utilizing a first reflow process, wherein after said attaching an interposer, the interposer is warped a first amount;
- after said attaching an interposer, attaching a semiconductor die to the interposer utilizing a second reflow process, wherein during said attaching a semiconductor die a region between the interposer and the substrate is free of underfill, and wherein after said attaching a semiconductor die, the interposer has less warpage than the first amount.
Dependencies are inferred from the claim text.