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US 2016/0079200 A1Published application
Apparatus and method for manufacturing semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorNaoyuki KOMUTA
Life of this patent
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Abstract
A manufacturing apparatus of a semiconductor device includes a stage, a head unit configured to face the stage, a driving unit configured to move the head unit towards and away from the stage, a heating unit configured to heat the head unit, and a control unit configured to control the driving unit to move the head unit away from the stage when the heating unit heats the head unit.
Claims20
A manufacturing apparatus of a semiconductor device, comprising:
- a stage;
- a head unit configured to face the stage;
- a driving unit configured to move the head unit towards and away from the stage;
- a heating unit configured to heat the head unit;
- and
- a control unit configured to control the driving unit to move the head unit away from the stage when the heating unit heats the head unit.
3 more elements
A method for manufacturing a semiconductor device, comprising:
- placing a semiconductor element having a plurality of electrodes, on a substrate with a holder, such that a plurality of metal bumps is pressed between the electrodes and the substrate;
- heating the metal bumps so as to be melted while moving the holder away from the substrate;
- and
- cooling the metal bumps so as to be solidified.
1 more element
A method for manufacturing a semiconductor device, comprising:
- placing a semiconductor element having a plurality of electrodes, on a substrate with a holder, such that a plurality of metal bumps is pressed between the electrodes and the substrate with a first force;
- moving the semiconductor element away from the substrate such that the metal bumps are pressed between the electrodes and the substrate with a second force that is smaller than the first force;
- heating the metal bumps so as to be melted;
- and
- cooling the metal bumps so as to be solidified.
2 more elements
Dependencies are inferred from the claim text.