Apparatus for bonding semiconductor chips

A method of operating a semiconductor chip bonding apparatus, the method comprising:

• adsorptively picking up semiconductor chips with a bonding head;
• mounting the semiconductor chips on a semiconductor substrate disposed on a bonding stage;
• correcting positions of the semiconductor chips on the semiconductor substrate;
• and
• applying heat and pressure to the semiconductor chips, such that the semiconductor chips are bonded to the semiconductor substrate,
• wherein correcting positions of the semiconductor chip, includes:
• transferring the bonding head to face an upper portion of a correction chip,
• adsorptively picking up the correction chip with the bonding head,
• obtaining positional information regarding the correction chip by capturing an image of the correction chip with a first camera,
• transferring a correction substrate formed on one side surface of the bonding stage to a predetermined position,
• obtaining information regarding a mounting position of the correction substrate by capturing an image of the mounting position of the correction substrate with a second camera,
• mounting the correction chip in the mounting position of the correction substrate with the bonding head,
• determining whether the correction chip is precisely mounted in the mounting position of the correction substrate, and
• calculating a correction offset value when the correction chip is not precisely mounted on the correction substrate to correct chip mounting positions.

A semiconductor chip bonding apparatus, comprising:

• a bonding head to adsorptively pick up a semiconductor chip;
• a first camera to capture an image of the semiconductor chip on the bonding head, and to determine a position of the semiconductor chip relative to the bonding head;
• a bonding stage supporting a substrate, the semiconductor chip to be bonded to the substrate on the bonding stage;
• a second camera to capture an image of the substrate, and to obtain positional information regarding the substrate;
• a correction device structure connected to the bonding stage, the correction device structure including a correction substrate and at least one correction chip;
• and
• a bonding controller to control mounting of the at least one correction chip on the correction substrate, calculating position precision of the correction chip on the correction substrate, and correcting a bonding position of the semiconductor chip on the substrate with respect to the calculated position precision of the correction chip on the correction substrate.