Semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorJun TANAKA
Life of this patent
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Abstract
A semiconductor device includes a first substrate and a second substrate facing the first substrate, each substrate having conductive pads disposed thereon, an insulating adhesive layer sealing the space between the first substrate and the second substrate, and a plurality of bumps penetrating the insulating adhesive layer and electrically connecting the plurality of first conductive pads and the plurality of second conductive pads. The plurality of bumps include at least a first bump having a first height and a second bump that is provided in a position closer to a geometric center of the second substrate than the first bump and has a second height greater than the first height.
Claims20
A semiconductor device comprising:
- a first substrate having a surface;
- a plurality of first conductive pads provided on the surface of the first substrate;
- a second substrate having a surface;
- a plurality of second conductive pads provided below the surface of the second substrate, wherein the surface of the first substrate faces the surface of the second substrate;
- a sealing layer sealing a space between the first substrate and the second substrate;
- and
- a plurality of bumps electrically connecting the plurality of first conductive pads and the plurality of second conductive pads,
- wherein the plurality of bumps include at least a first bump and a second bump, wherein the second bump is provided in a position closer to a geometric center of the second substrate than the first bump,
- the first bump has a first height, and
- the second bump has a second height greater than the first height.
A semiconductor device comprising:
- a first substrate having conductive pads above a surface thereof;
- a second substrate having conductive pads below a surface thereof;
- a plurality of bumps electrically connecting the plurality of first conductive pads and the plurality of second conductive pads;
- and
- a sealing layer sealing a space between the first substrate and the second substrate,
- wherein the plurality of bumps include at least a first bump and a second bump, wherein the second bump is closer to a geometric center of the first and second substrates and has a height that is greater than a height of the first bump.
Dependencies are inferred from the claim text.