Semiconductor substrate and semiconductor package structure
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsTien-Szu Chen, Sheng-Ming Wang, Kuang-Hsiung Chen, Yu-Ying Lee
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Abstract
A semiconductor substrate includes an insulating layer, a first conductive patterned layer disposed adjacent to a first surface of the insulating layer, and conductive bumps disposed on the first conductive patterned layer. Each conductive bump has a first dimension along a first direction and a second dimension along a second direction perpendicular to the first direction, and the first dimension is greater than the second dimension. A semiconductor package structure includes the semiconductor substrate, at least one die electrically connected to the conductive bumps, and a molding compound encapsulating the conductive bumps.
Claims20
A semiconductor substrate, comprising:
- an insulating layer;
- a first conductive patterned layer disposed adjacent to a first surface of the insulating layer;
- and
- a plurality of conductive bumps disposed on the first conductive patterned layer, wherein each conductive bump has a first dimension along a first direction and a second dimension along a second direction perpendicular to the first direction, and the first dimension is greater than the second dimension.
A semiconductor package structure, comprising:
- a semiconductor substrate, comprising:
- an insulating layer;
- a plurality of conductive traces disposed adjacent to a first surface of the insulating layer;
- and
- a plurality of conductive bumps disposed on respective ones of the conductive traces, each conductive bump being elongated along a lengthwise direction of a respective conductive trace;
- at least one die, electrically connected to the conductive bumps;
- and
- a molding compound, encapsulating the conductive bumps.
Dependencies are inferred from the claim text.