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US 2016/0079192 A1Published application
Metal Routing Architecture for Integrated Circuits
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChen-Cheng Kuo, Chita Chuang, Chih-Hua Chen, Chen-Shien Chen, Yao-Chun Chuang
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Abstract
A device includes a substrate, a metal pad over the substrate, and a metal trace electrically disconnected from the metal pad. The metal pad and the metal trace are level with each other. A passivation layer includes a portion overlapping an edge portion of the metal pad. A metal pillar is overlying the metal pad, and is electrically connected to the metal pad. The metal trace has a portion overlapped by the metal pillar.
Claims20
A device comprising:
- a substrate;
- a metal pad over the substrate;
- a first metal trace electrically decoupled from the metal pad, wherein a first top surface of the metal pad and a second top surface of the first metal trace are level with each other;
- and
- an Under-Bump Metallurgy (UBM) comprising:
- a bottom surface in contact with the first top surface of the metal pad;
- and
- a portion overlapping a portion of the first metal trace.
5 more elements
A device comprising:
- a substrate;
- a metal pad over the substrate;
- a first metal trace disconnected from the metal pad;
- a conductive feature, wherein the first metal trace comprises a first portion overlapped by the conductive feature, and a second portion extending beyond edges of the conductive feature, and wherein the conductive feature comprises:
- a first portion having a bottom surface in contact with the metal pad;
- and
- a second portion;
- and
- a polymer layer comprising a portion having a top surface contacting a bottom surface of the second portion of the conductive feature, wherein the portion of the polymer layer overlaps the first portion of the first metal trace.
6 more elements
A device comprising:
- a metal pad;
- a first metal trace connected to the metal pad;
- a passivation layer contacting a first top surface and a first sidewall of the metal pad, and a second top surface and a second sidewall of the first metal trace, wherein the first sidewall and the second sidewall face each other;
- a polymer layer overlying the passivation layer;
- an Under-Bump Metallurgy (UBM) comprising:
- a first portion overlying and contacting the metal pad, wherein the first portion of the UBM penetrates through the polymer layer;
- and
- a second portion contacting a top surface of the polymer layer;
- and
- a second metal trace coplanar with the first metal trace, the second metal trace comprising:
- a first portion overlapped by the second portion of the UBM;
- and
- a second portion extending beyond edges of the UBM.
10 more elements
Dependencies are inferred from the claim text.