Package with ubm and methods of forming

A package structure comprising:

• an integrated circuit die;
• an encapsulant at least laterally encapsulating the integrated circuit die;
• a redistribution structure on the integrated circuit die and the encapsulant, the redistribution structure comprising a first dielectric layer disposed distally from the encapsulant and the integrated circuit die;
• a connector support metallization coupled to the redistribution structure, the connector support metallization having a first portion on a first surface of the first dielectric layer, a second portion extending along a bottom surface of a first opening through the first dielectric layer, and a third portion extending along a sidewall of the first opening and between the first portion and the second portion, a joint being formed at a location where the second portion meets the third portion;
• a second dielectric layer on the first surface of the first dielectric layer and on the first portion, the third portion, and at least a portion of the second portion of the connector support metallization;
• and
• an external connector through a second opening through the second dielectric layer and on the connector support metallization.

A method comprising:

• encapsulating an integrated circuit die with an encapsulant;
• forming a redistribution structure on the integrated circuit die and the encapsulant, the redistribution structure comprising a first dielectric layer having a first surface distal from the integrated circuit die and the encapsulant;
• forming an under ball metallization (UBM) and a dummy pattern on the redistribution structure, the dummy pattern surrounding the UBM on the first surface of the first dielectric layer;
• forming a second dielectric layer on the first surface of the first dielectric layer and at least a portion of the dummy pattern, wherein after the forming the second dielectric layer, the second dielectric layer does not contact the UBM;
• and
• forming an external electrical connector on the UBM.