Methods to control wafer warpage upon compression molding thereof and articles useful therefor
AssigneeHenkel IP & Holding GmbH
InventorsTadashi Takano, Gina Hoang
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Abstract
Provided herein are multilayer structures having a reduced propensity to warp upon curing of certain components thereof. In one aspect, there are provided multilayer assemblies comprising a plurality of the above-described multilayer structures. In another aspect, there are provided methods for reducing wafer warpage upon cure of molding compositions applied thereto. In yet another aspect, there are provided methods for preparing wafers having substantially no warpage upon cure thereof.
Claims26
A multilayer structure comprising:
- a silicon layer containing a plurality of chips on one face thereof and an underfill layer underneath said chips,
- a curable molding formulation applied to the same face as said plurality of chips, and
- a reinforcing element applied to said molding formulation,
- wherein the coefficient of thermal expansion (CTE) of the reinforcing element is sufficiently similar to the CTE of the silicon layer so as to minimize warping of said structure upon cure of said molding formulation.
A multilayer structure comprising:
- a silicon layer containing a plurality of chips thereon and an underfill layer underneath said chips,
- a cured molding formulation applied to the same face as said plurality of chips, and
- a reinforcing element applied to said molding formulation,
- wherein the coefficient of thermal expansion (CTE) of the reinforcing element is sufficiently similar to the CTE of the silicon layer so as to minimize warping of said structure upon cure of said molding formulation.
A method to reduce wafer warpage upon cure of a curable molding formulation applied to one side of a silicon support, said method comprising applying a reinforcing element to said curable molding formulation prior to curing thereof.
A method to prepare wafers having substantially no warpage upon cure thereof, said method comprising:
- applying a curable molding formulation to one side of a silicon layer, then
- applying a reinforcing element to said curable molding formulation.
A method to prepare wafers having substantially no warpage upon cure thereof, said method comprising applying a reinforcing element to one side of a silicon interposer having a molding formulation thereon.
Dependencies are inferred from the claim text.