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US 2016/0079186 A1Published application
Semiconductor device manufacturing method and semiconductor device
AssigneeRenesas Electronics Corporation
InventorHiroaki NARITA
Life of this patent
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Abstract
There is provided a technology by which the position of 1 pin in a tabless package can be recognized easily. The rear surfaces of plural leads are exposed on a rear surface of a resin-sealed body which seals a semiconductor chip etc., a image recognition area is further provided adjacent to 1 pin (lead with index 1), and a rear surface of an identification mark is exposed from the rear surface of the resin-sealed body of the image recognition area. This identification mark is made of the same conductive member as the plural leads.
Claims5
1-9. (canceled)
A resin-sealed semiconductor device, comprising:
- a semiconductor chip;
- a plurality of leads made of a conductive member arranged on the periphery of the semiconductor chip;
- a plurality of conductive wires electrically connecting a plurality of electrode pads of the semiconductor chip and the plurality of leads;
- an identification mark made of the conductive member arranged near one lead among the plurality of leads;
- a suspension lead coupled with the identification mark;
- and a sealed body which seals with a resin the semiconductor chip, a part of front and side surfaces of the plurality of leads, the plurality of conductive wires, front and side surfaces of the identification mark, and a part of front, rear and side surfaces of the suspension lead, wherein:
- the rear surfaces of the plurality of leads and the rear surface of the identification mark are exposed on the rear surface of the sealed body.
4 more elements
Dependencies are inferred from the claim text.