Semiconductor package and method of manufacturing the same
AssigneeSamsung Electronics Co., Ltd.
InventorYeongseok Kim
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Abstract
A semiconductor package including a marking film and a method of fabricating the same are provided wherein a marking film including a thermoreactive layer may be applied to a molding layer to protect a semiconductor chip under the molding layer and to efficiently perform a marking process. The thickness of the molding layer may thereby be reduced so the entire thickness of the semiconductor package may be reduced. Also, it is possible to prevent warpage of the semiconductor package through the marking film, provide the surface of the semiconductor package with gloss and freely adjust the color of the surface of the semiconductor package.
Claims20
A semiconductor package comprising:
- a package substrate on which a semiconductor chip is mounted;
- a molding layer that covers the package substrate and molds the semiconductor chip;
- and
- a marking film disposed on the molding layer, wherein the marking film comprises a thermoreactive layer that reacts to an electromagnetic wave.
A method of fabricating a semiconductor package, the method comprising:
- providing a package substrate on which a semiconductor chip is mounted;
- forming a molding layer covering the package substrate and molding the semiconductor chip;
- and
- forming a marking film comprising a thermoreactive layer on the molding layer, wherein the thermoreactive layer reacts to an electromagnetic wave.
A semiconductor package comprising:
- a package substrate on which a semiconductor chip is mounted;
- a molding layer that covers the package substrate and molds the semiconductor chip;
- and
- a marking film disposed on the molding layer, wherein the marking film comprises a thermoreactive layer that reacts to an electromagnetic wave and reflectors consisting of reflector material that reflects the electromagnetic wave.
Dependencies are inferred from the claim text.