Wafer and method for manufacturing microscopic structure on wafer
AssigneeKabushiki Kaisha Toshiba
InventorYusuke ARAYASHIKI
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Abstract
According to one embodiment, a method is disclosed for manufacturing a microscopic structure. The method can include forming a stacked body including a plurality of films on a substrate, an upper surface of a mark region of the substrate for alignment being formed at a position lower than an upper surface of a portion of the substrate where a structural pattern is to be formed, aligning the substrate and a template using a configuration of an upper surface of the stacked body formed in the mark region, coating a material in a liquid form or a semi-liquid form onto the stacked body, pressing the template onto the material; forming a pattern by curing the material, releasing the template from the pattern, and patterning the stacked body using the pattern as a mask.
Claims7
A method for manufacturing a microscopic structure, comprising:
- forming a stacked body including a plurality of films on a substrate, an upper surface of a mark region of the substrate for alignment being formed at a position lower than an upper surface of a portion of the substrate where a structural pattern is to be formed;
- aligning the substrate and a template using a configuration of an upper surface of the stacked body formed in the mark region;
- coating a material in a liquid form or a semi-liquid form onto the stacked body;
- pressing the template onto the material;
- forming a pattern by curing the material;
- releasing the template from the pattern;
- and
- patterning the stacked body using the pattern as a mask.
A method for manufacturing a microscopic structure, comprising:
- aligning a template and a substrate, an upper surface of a mark region of the substrate for alignment being formed at a position lower than an upper surface of a portion of the substrate where a structural pattern is to be formed;
- coating a material in a liquid form or a semi-liquid form onto the substrate;
- contacting the template and the material each other;
- forming a pattern by curing the material;
- separating the template and the pattern;
- and
- processing the substrate using the pattern as a mask.
A wafer, comprising:
- a pattern formation region where a structural pattern is to be formed, the pattern formation region being a portion of one surface;
- and
- a mark region where a mark for alignment to be used in imprinting is formed, the mark region being one other portion of the one surface,
- an upper surface of the mark region being formed at a position lower than an upper surface of the pattern formation region.
Dependencies are inferred from the claim text.