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US 2016/0079171 A1Published application
Semiconductor package including an embedded surface mount device and method of forming the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsDer-Chyang Yeh, Hsien-Wei Chen, Ming-Yen Chiu, Ying-Ju Chen
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Abstract
Embodiments of the present disclosure include semiconductor packages and methods of forming the same. An embodiment is a semiconductor package including a first package including one or more dies, and a package substrate bonded to a first side of the first package with by a first set of connectors. The semiconductor package further includes a surface mount device mounted to the first side of the first package, the surface mount device consisting essentially of one or more passive devices.
Claims20
A device comprising:
- a first package comprising:
- a first die;
- a molding material at least laterally encapsulating the first die;
- a first electrical connector adjacent the first die and extending from a first side of the molding material to a second side of the molding material, the second side being opposite the first side;
- an interconnect structure proximate the first side of the molding material, the interconnect structure being electrically coupled to the first electrical connector and the first die;
- and
- a surface mount device mounted to interconnect structure;
- and
- a substrate bonded to the interconnect structure of the first package by a first set of electrical connectors, the surface mount device being between the first die and the substrate.
6 more elements
A structure comprising:
- a first package comprising:
- an interconnect structure proximate a first side of a first die, the interconnect structure having a recessed portion;
- and
- a surface mount device in the recessed portion of the interconnect structure;
- a substrate being bonded to the interconnect structure of the first package using a first set of conductive connectors;
- and
- a second package comprising a second die, the second package being bonded to the first package by a second set of conductive connectors, the second package being proximate a second side of the first die, the second side being opposite the first side.
4 more elements
A method comprising:
- forming a first package comprising:
- forming an electrical connector over a carrier substrate;
- attaching a first die to the carrier substrate, the electrical connector extending from a second side of the first die to a first side of the first die, the second side being opposite the first side, the electrical connector being adjacent the first die;
- encapsulating the first die and the electrical connector with a molding compound;
- forming an interconnect structure proximate the first side of the first die and the molding compound;
- bonding a surface mount device to the interconnect structure;
- and
- removing the first package from the carrier substrate.
5 more elements
Dependencies are inferred from the claim text.