Semiconductor package structure and method of fabricating the same

A method of fabricating a semiconductor package structure, comprising:

• providing a release member that has opposing top and bottom surfaces;
• forming a plurality of first conductive pads and a plurality of second conductive pads on the top surface of the release member;
• disposing a semiconductor component on the first conductive pads and electrically connecting the semiconductor component to the first conductive pads, forming a plurality of conductive elements on the second conductive pads, each of the conductive elements having opposing first and second ends, and forming on the top surface of the release member a package body having opposing first and second surfaces and encapsulating the semiconductor component and the conductive elements, with the first and second conductive pads exposed from the first surface of the package body, and the second ends of the conductive elements exposed from the second surface of the package body;
• and
• removing the release member.

A method of fabricating a semiconductor package structure, comprising:

• providing a release member having opposing top and bottom surfaces;
• forming a patterned first dielectric layer, from which a portion of the top surface of the release member is exposed;
• forming a plurality of first conductive pads and a plurality of second conductive pads on the exposed portion of the top surface of the release member;
• disposing a semiconductor component on the first conductive pads and electrically connecting the semiconductor component to the first conductive pads, forming a plurality of conductive elements on the second conductive pads, each of the conductive elements having opposing first and second ends, and forming on the first dielectric layer a second dielectric layer, in which the conductive elements and the semiconductor component are embedded, the first and second dielectric layers forming a package body that has a first surface coupled to the first dielectric layer and a second surface coupled to the second dielectric layer;
• and
• removing the release member.