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US 2016/0079169 A1Published application
Polymer member based interconnect
AssigneeInvensas Corporation
InventorsCyprian Emeka Uzoh, Rajesh Katkar, Charles G. Woychik, Guilian Gao, Arkalgud R. Sitaram
Life of this patent
Estimating the term…
Abstract
An interconnect (124) suitable for attachment of integrated circuit assemblies to each other comprises a polymer member (130) which is conductive and/or is coated with a conductive material (144). Such interconnects replace metal bond wires in some embodiments. Other features are also provided.
Claims29
A first structure comprising:
- a substrate comprising a top surface and comprising circuitry with one or more contact pads at the top surface;
- a first microelectronic component disposed on a first region of the substrate;
- a plurality of first members disposed on a second region of the substrate, each first member comprising a dielectric core comprising one or more polymers, each first member also comprising a plurality of conductive lines each of which extends on a sidewall surface of the dielectric core of the first member and extends from the second region of the substrate to a top of the first member, each conductive line being electrically connected to at least one said contact pad;
- and
- wherein each conductive line comprises one or more contact pads for connecting the corresponding first member to one or more second microelectronic components.
2 more elements
2-3. (canceled)
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13-20. (canceled)
A structure comprising:
- a plurality of electrically conductive interconnects, each interconnect comprising a dielectric member comprising one or more polymers and extending along the interconnect, the dielectric member comprising a first area at a bottom of the interconnect, a second area at a top of the interconnect, and a sidewall surface between the first and second areas, the interconnect comprising one or more electrically conductive lines on the sidewall surface that cover a part, but not all, of the sidewall surface, each conductive line extending from the first are to the second area;
- a continuous dielectric layer that laterally encapsulates each said interconnect along at least a part of the length of the interconnect but does not cover top and bottom ends of each said conductive line to allow the conductive lines to be attached to circuitry which is not part of the structure, the continuous dielectric layer physically contacting the sidewall surface of each said dielectric member.
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27-28. (canceled)
Dependencies are inferred from the claim text.