Contact Pad for Semiconductor Devices
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHsien-Wei Chen, Jie Chen, Ying-Ju Chen
Life of this patent
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Abstract
Packaging devices and methods of manufacture thereof for semiconductor devices are disclosed. In some embodiments, a packaging device includes a contact pad disposed over a substrate, and a passivation layer and/or polymer layer disposed over the substrate and a portion of the contact pad. A post passivation interconnect (PPI) line is disposed over the passivation layer and is coupled to an exposed portion of the contact pad. A PPI pad is disposed over the passivation layer. A transition element is disposed over the passivation layer and is coupled between the PPI line and the PPI pad. The transition element includes line having a width greater than the PPI line.
Claims20
A semiconductor structure comprising:
- a substrate having a contact pad thereon;
- an insulating layer over the substrate, wherein a portion of the contact pad is exposed;
- and
- a conductive interconnect electrically coupled between the contact pad and an external connection, the conductive interconnect having a first line portion, a pad portion, and a second line portion interposed between the first line portion and the pad portion, a width of the second line portion being greater than a width of the first line portion, the second line portion having substantially parallel sidewalls.
A method of forming a semiconductor device, the method comprising:
- forming a contact pad on a substrate;
- forming one or more insulating layers over the substrate, wherein an exposed portion of the contact pad is exposed;
- and
- forming a conductive interconnect over the one or more insulating layers and the exposed portion of the contact pad, the conductive interconnect having a first line portion, a rounded pad, and one or more intervening line portions between the rounded pad and the first line portion, each of the one or more intervening line portions having a width wider and a previous line portion.
A method of forming a semiconductor device, the method comprising:
- forming a contact pad on a substrate;
- forming one or more insulating layers over the substrate, wherein an exposed portion of the contact pad is exposed;
- and
- forming a conductive interconnect over the one or more insulating layers and the exposed portion of the contact pad, the conductive interconnect having a first line portion, a pad portion, and a first transition portion interposed between the first line portion and the pad portion, the first transition portion having one or more first linear segments, each of the one or more first linear segments having substantially parallel sidewalls, a width of each of the one or more first linear segments having a width greater than a width of the first line portion.
Dependencies are inferred from the claim text.