Semiconductor Device
AssigneeMitsubishi Electric Corporation
InventorTaichi OBARA
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Abstract
A semiconductor device according to the present invention includes: an insulating substrate; a circuit pattern having a first surface that is bonded to a first main surface of the insulating substrate and a second surface opposite to the first surface on which a semiconductor element is bonded; a back surface pattern having a first surface that is bonded to a second main surface of the insulating substrate; and a heat dissipation plate bonded to a second surface of the back surface pattern opposite to the first surface of the back surface pattern. A curvature of a corner portion of the circuit pattern is greater than a curvature of a corner portion of the back surface pattern, and the corner portion of the circuit pattern is located inside the corner portion of the back surface pattern in a plan view.
Claims20
A semiconductor device, comprising:
- an insulating substrate;
- a circuit pattern having a first surface that is bonded to a first main surface of said insulating substrate and a second surface opposite to said first surface on which a semiconductor element is bonded;
- a back surface pattern having a first surface that is bonded to a second main surface of said insulating substrate;
- and
- a heat dissipation plate bonded to a second surface of said back surface pattern opposite to said first surface of said back surface pattern, wherein
- a curvature of a corner portion of said circuit pattern is greater than a curvature of a corner portion of said back surface pattern, and
- the corner portion of said circuit pattern is located inside the corner portion of said back surface pattern in a plan view.
A semiconductor device, comprising:
- an insulating substrate;
- a circuit pattern that is bonded to a first main surface of said insulating substrate and includes a semiconductor element bonded to a surface opposite to the surface bonded to said first main surface;
- a back surface pattern bonded to a second main surface of said insulating substrate;
- and
- a heat dissipation plate bonded to a surface of said back surface pattern, the surface being opposite to a surface bonded to said second main surface, wherein
- a corner portion of said circuit pattern is formed in a polygonal line, and
- the corner portion of said circuit pattern is located inside a corner portion of said back surface pattern in a plan view.
Dependencies are inferred from the claim text.