Package structure with an embedded electronic component and method of fabricating the package structure

A method of fabricating a package structure with an embedded component, comprising:

• Forming on a bonding carrier, a first wiring layer having opposing first and second surfaces, and disposing an electronic component on the bonding carrier, wherein the second surface of the first wiring layer is coupled to the bonding carrier;
• forming on the first wiring layer an encapsulating layer that encapsulates the electronic component and is formed with at least a first hole for exposing a portion of the first surface of the first circuit therefrom;
• and
• forming a second wiring layer on the encapsulating layer, in a manner that a portion of the second wiring is filled into the at least a first hole, so as for the second wiring layer to be electrically connected with the first wiring layer.