Techniques and configurations associated with a package load assembly

A package assembly comprising:

• a package substrate having an integrated circuit (IC) die disposed thereon;
• an integrated heat spreader (IHS) coupled with the IC die to transfer thermal energy away from the IC die;
• a heat sink coupled with a surface of the IHS to transfer thermal energy away from the IHS;
• and
• a frame configured to form a perimeter around the IHS, the frame having a first surface coupled with a surface of the package substrate, and a plurality of deformable members disposed on a second surface of the frame, the second surface disposed opposite the first surface, the plurality of deformable members configured to distribute a force applied between the heat sink and the package substrate, via the frame, and to deform under the force to allow a base of the heat sink to couple with the surface of the IHS.

A method of forming a package assembly comprising:

• providing an integrated circuit (IC) package substrate having an IC die and an integrated heat spreader IHS disposed thereon;
• coupling a package load assembly with the IC package substrate, wherein the package load assembly includes:
• a frame forming a perimeter around the IHS, and a plurality of deformable members disposed on a surface of the frame;
• and
• coupling a heat sink to the package load assembly, wherein the plurality of deformable members distribute a force applied between the heat sink and the IC package substrate and deform under the force to allow a base of the heat sink to couple with a surface of the IHS.