Semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorsEiji SHIMADA, Gentaro OOKURA, Hiroyuki INAGI
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Abstract
A semiconductor device includes a package part having a semiconductor element sealed in resin, a plurality of first leads each having an outer portion extending from a first side of the package part, and a plurality of second leads each having an outer portion extending from a second side of the package part. A combined bottom surface area of the outer portions of the plurality of first leads is greater than a combined bottom surface area of the outer portions of the plurality of second leads. The semiconductor device also includes a heat dissipation plate provided on the bottom surface of the package part and connected to at least one of the plurality of second leads.
Claims20
A semiconductor device, comprising:
- a package part including a semiconductor element sealed with resin;
- a plurality of first leads each having an outer portion extending from a first side of the package part;
- a plurality of second leads each having an outer portion extending from a second side of the package part, the second side opposing the first side;
- and
- a heat dissipation plate provided at a bottom surface of the package part and connected to at least one of the plurality of second leads, wherein
- the outer portions of the plurality of first leads have a combined bottom surface area that is greater than a combined bottom surface area of the outer portions of the plurality of second leads.
A semiconductor device, comprising:
- a semiconductor element sealed within a resin package;
- a plurality of first leads each having an outer portion extending from a first side of the resin package;
- a plurality of second leads each having an outer portion extending from a second side of the resin package, the second side opposing the first side, a combined bottom surface area of the outer portions of the plurality of first leads being greater than a combined bottom surface area of the outer portions of the plurality of second leads;
- a heat dissipation plate provided on the bottom surface of the resin package and connected to at least one of the plurality of second leads;
- a substrate having a first landing and a second landing on a surface of the substrate facing the package part;
- a first solder connecting a bottom surface of the outer portion of at least one of the first leads to the first landing;
- and
- a second solder connecting a bottom surface of the outer portion of at least one of second leads to the second landing.
A semiconductor device, comprising:
- a package part including a semiconductor element sealed with resin;
- a plurality of first leads each having an outer portion extending from a first side of the package part;
- a plurality of second leads each having an outer portion extending from a second side of the package part, the second side opposing the first side;
- and
- a heat dissipation plate provided at a bottom surface of the package part and connected to at least one of the plurality of second leads, wherein
- at least one of the outer portions of the plurality of first leads has a first width that is wider than a second width of at least one of the outer portions of the plurality of second leads, and
- the first width and second width are along a direction parallel to the first side.
Dependencies are inferred from the claim text.