Inter-connection of a lead frame with a passive component intermediate structure
AssigneeNXP B.V.
InventorsBodin Kasemset, Peeradech Khunpukdee, Krassavan Tantirittisak
Life of this patent
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Abstract
Consistent with an example embodiment, there is a package assembly structure. The structure comprises a lead frame having a topside surface and an opposite under-side surface; the lead frame includes a die attach paddle, wherein a die attach region is defined on the opposite under-side surface. Pad landings surround the die attach region. A plurality of locking pins are arranged at predetermined locations about the die attach paddle, on the top side surface. The plurality of locking pins may be formed integrally in the lead frame and project upward from the top side surface.
Claims13
A package assembly structure comprising:
- a lead frame having a top-side surface and an opposite under-side surface, the lead frame including:
- a die attach paddle, wherein a die attach region is defined on the opposite under-side surface;
- pad landings surrounding the die attach region;
- and
- a plurality of locking pins arranged at predetermined locations about the die attach paddle, on the top-side surface.
An electronic device comprising:
- a lead frame having a top-side surface and an opposite under-side surface, the lead frame including, a die attach paddle, wherein a die attach region are defined on the opposite under-side surface, pad landings surrounding the die attach region;
- and a plurality of locking couplings of a gender arranged at predetermined locations about the die attach paddle, on the topside surface;
- an intermediate substrate having locking couplings of an opposite gender corresponding to the predetermined locations for frictionally receiving the locking couplings of the lead frame and providing mechanical connection between the lead frame and the intermediate substrate, the intermediate substrate mounted on the topside surface of the lead frame;
- wherein the intermediate substrate has areas defined for passive component circuits;
- and
- an active device die attached to the die attach region on the opposite under-side surface of the lead frame wherein bond pads of the active device die are electrically connected to the pad landings of the lead frame by conductive interconnects.
Dependencies are inferred from the claim text.