Graphene based filler material of superior thermal conductivity for chip attachment in microstructure devices
AssigneeSTMicroelectronics S.r.l.
InventorsMario Giovanni Scurati, Laura Ceriati, Luciano Benini
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Abstract
An integrated circuit chip attachment in a microstructure device is accomplished through the use of an adhesive-based material in which graphene flakes are incorporated. This results in superior thermal conductivity. The spatial orientation of the graphene flakes is controlled, for example by adhering polar molecules to the graphene flakes and exposing the flakes to an external force field, so that the graphene flakes have desired orientations under the integrated circuit chip, alongside of the integrated circuit chip and above the integrated circuit chip.
Claims20
A method, comprising:
- positioning a microstructure device chip above a surface of a substrate;
- and
- providing therebetween a filler material that is thermally conductive and comprises graphene flakes.
A method, comprising:
- depositing a layer a filler material that is thermally conductive and comprises graphene flakes on a substrate wafer;
- mounting a plurality of semiconductor device chips to the substrate wafer with the deposited layer positioned between each semiconductor device chip and the substrate wafer;
- and
- dicing the substrate wafer to produce a plurality of die structures, with each die structure including at least one semiconductor device chip attached to a diced portion of the substrate wafer by said deposited layer of filler material.
Dependencies are inferred from the claim text.