Semiconductor device and manufacturing method for same
AssigneeMitsubishi Electric Corporation
InventorKen SAKAMOTO
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Abstract
In the present invention, a heat spreader has a sagging surface or a C surface being a chamfered portion at an outer peripheral end portion of a back surface thereof. A plurality of power elements formed into chips are mounted on a surface of the heat spreader with a solder therebetween, and an insulating sheet portion is located on the back surface side of the heat spreader. The insulating sheet portion has a laminated structure of an insulating layer and a metal foil, and the insulating layer being the upper layer is closely bonded to the back surface of the heat spreader. A space region between the sagging surface and the insulating sheet portion is filled with a molding resin.
Claims10
A semiconductor device having a structure in which a semiconductor element is sealed with a molding resin, said semiconductor device comprising:
- a heat spreader having a surface on which said semiconductor element is mounted;
- and
- an insulating sheet portion located on a back surface of said heat spreader, wherein
- said insulating sheet portion has a laminated structure of an insulating layer having a thermal conductivity higher than that of said molding resin and a metal layer, said insulating layer being closely bonded to the back surface of said heat spreader,
- said heat spreader has a chamfered portion obtained by R chamfering or C chamfering at an outer peripheral end portion of the back surface thereof,
- said insulating sheet portion is formed so as to have the same plane along the back surface of said heat spreader, a space region (S2) being provided between said chamfered portion and said insulating sheet portion, and
- said molding resin seals said semiconductor element, said heat spreader, and said insulating sheet portion except for a back surface of said metal layer.
A semiconductor device having a structure in which a semiconductor element is sealed with a molding resin, said semiconductor device comprising:
- a heat spreader having a surface on which said semiconductor element is mounted;
- and
- an insulating sheet portion located on a back surface of said heat spreader, wherein
- said insulating sheet portion has a laminated structure of an insulating layer having a thermal conductivity higher than that of said molding resin and a metal layer, said insulating layer being closely bonded to the back surface of said heat spreader,
- said heat spreader has a chamfered portion obtained by R chamfering or C chamfering at an outer peripheral end portion of the back surface thereof,
- said insulating sheet portion has a main body portion and a bent portion, said main body portion forming the same plane along the back surface of said heat spreader, said bent portion having a surface region formed so as to be bent from said main body portion and being closely bonded to said chamfered portion, and
- said molding resin seals said semiconductor element, said heat spreader, and said insulating sheet portion except for a back surface of said metal layer in said main body portion.
Dependencies are inferred from the claim text.