Semiconductor device
AssigneeMitsubishi Electric Corporation
InventorsShigeru HASEGAWA, Kazuhiro MORISHITA, Ryo TSUDA, Yukimasa HAYASHIDA, Goro YASUTOMI, Ryutaro DATE
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Abstract
A base plate, and a plurality of unit structures formed on the base plate are provided. Each of the unit structures including an insulating substrate fixed on the base plate, a metal pattern formed on the insulating substrate, a semiconductor element electrically connected to the metal pattern, and a main electrode having an upper end portion exposed to the outside and a lower end portion connected to a peripheral portion of the metal pattern closest to an outer edge of the base plate.
Claims14
A semiconductor device comprising:
- a base plate formed into a rectangular shape as viewed in plan;
- and
- a plurality of unit structures formed nearer to a first side of the base plate and a plurality of unit structures formed nearer to a second side of the base plate opposite from the first side, each of the unit structures including:
- an insulating substrate fixed on the base plate;
- a metal pattern formed on the insulating substrate;
- a semiconductor element electrically connected to the metal pattern;
- and
- a main electrode having an upper end portion exposed to the outside and a lower end portion connected to a peripheral portion of the metal pattern closest to an outer edge of the base plate.
A semiconductor device comprising:
- a base plate formed into a rectangular shape as viewed in plan;
- and
- a plurality of unit structures formed on the base plate, each of the unit structures including:
- an insulating substrate fixed on the base plate;
- a metal pattern formed on the insulating substrate;
- a semiconductor element electrically connected to the metal pattern;
- and
- a main electrode having an upper end portion exposed to the outside and a lower end portion connected to a peripheral portion of the metal pattern closest to an outer edge of the base plate, wherein
- the plurality of unit structures include a first unit structure formed on a first side of the base plate, and a second unit structure formed on a second side of the base plate opposite from the first side, and
- the main electrode includes a first lower end portion connected to the peripheral portion of the first unit structure along the first side, and a second lower end portion connected to the peripheral portion of the second unit structure along the second side.
A semiconductor device comprising:
- a base plate formed into a rectangular shape as viewed in plan and having a first side and a second side opposite from the first side;
- a plurality of unit structures formed on the base plate, each of the unit structures including:
- an insulating substrate fixed on the base plate;
- a metal pattern formed on the insulating substrate;
- a semiconductor element electrically connected to the metal pattern;
- and
- a main electrode having an upper end portion exposed to the outside and a lower end portion connected to the metal pattern,
- wherein each of the lower end portions is located closer to the first side than a place defined by an advance from the first side toward the second side by ¼ of the distance from the first side to the second side or closer to the second side than a place defined by an advance from the second side toward the first side by ¼ of the distance from the second side to the first side.
Dependencies are inferred from the claim text.