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US 2016/0079141 A1Published application
Methods of forming serpentine thermal interface material and structures formed thereby
AssigneeIntel Corporation
InventorsPatrick Nardi, Kelly P. Lofgreen
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Abstract
Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include forming a thermal interface material comprising a thermally conductive serpentine foil located between a first and a second interface material. The serpentine foil may be in a parallel position or a rotated position, in embodiments.
Claims18
A package structure comprising:
- a first TIM structure comprising:
- a first interface material on a top surface of a device;
- a serpentine foil disposed on the first interface material, wherein the serpentine foil comprises a repeating serpentine pattern;
- a second interface material on the serpentine foil, wherein an apex portion of the serpentine foil is in contact with at least one of the first and second interface materials;
- and
- an integrated heat structure (IHS) disposed on the second interface material of the first TIM structure.
3 more elements
A package structure comprising:
- a first TIM structure comprising:
- a first interface material on a top surface of a device;
- a serpentine foil disposed on the first interface material, wherein the serpentine foil comprises a repeating serpentine pattern;
- a second interface material on the serpentine foil, wherein an apex portion of the serpentine foil is in contact with and extends into at least one of the first and second interface materials;
- and
- an integrated heat structure (IHS) disposed on the second interface material of the first TIM structure.
3 more elements
Dependencies are inferred from the claim text.