US 2016/0079140 A1 · COMPUTE INTENSIVE MODULE PACKAGING

Abstract

A package for a multi-chip module includes a top cold plate and a bottom plate whose perimeters are in thermal communication so the plates together completely encase the module except for a connector passing through the bottom plate. The cold plate has copper tubing pressed into a groove formed in a serpentine pattern. The perimeter of the cold plate has thermal conduction fins which mate with thermal conduction slots in the perimeter of the bottom plate. Thermal interface material is disposed in gaps between the plates and chips on the module, the gaps having dimensions controlled by support ribs of plates which abut the module substrate. The cold plate is used on the hottest side of the module, e.g., the side having computationally-intensive chips such as ASICs. A densely packed array of these packages can be used in a central electronic complex drawer with a shared coolant circulation system.

Claims21

Dependent claims

A package for an integrated circuit chip module comprising:

a generally planar substrate having first and second opposing surfaces;
a plurality of integrated circuit chips mounted on said first surface of said substrate;
a first heat sink in thermal communication with at least one of said plurality of integrated circuit chips;
and
a second heat sink located opposite said first heat sink with respect to said substrate, at least a portion of said first heat sink being in contact with a portion of said second heat sink, said first and second heat sinks together substantially surrounding said integrated circuit chips.

2 more elements

A multi-chip module package comprising:

a generally rectangular, planar substrate having top and bottom surfaces;
a first plurality of integrated circuit chips mounted on said top surface of said substrate, said top surface having first connection features formed thereon which are operatively interconnected with first connection points of said first plurality of integrated circuit chips;
a second plurality of integrated circuit chips mounted on said bottom surface of said substrate, said bottom surface having second connection features formed thereon which are operatively interconnected with second connection points of said second plurality of integrated circuit chips;
a connector block mounted on said bottom surface of said substrate for interconnecting external connection features with said first and second connection features;
a generally rectangular top cold plate disposed parallel with said substrate in thermal communication with at least one of said first plurality of integrated circuit chips;
and
a generally rectangular bottom heat dissipation plate disposed parallel with said substrate and located opposite said top cold plate with respect to said substrate in thermal communication with at least one of said second plurality of integrated circuit chips, said connector block passing through a connector cutout in said bottom heat dissipation plate, and a perimeter of said top cold plate being in direct thermal communication with a perimeter of said bottom heat dissipation plate such that said top cold plate and said bottom heat dissipation plate together completely encase said first and second pluralities of integrated circuit chips except for the connector cutout.

4 more elements

A central electronic complex draw for a computer system comprising:

a chassis;
a planar board supported by said chassis;
a plurality of multi-chip module (MCM) packages mounted on said planar board in an array of rows and columns, each MCM package having
a planar substrate with top and bottom surfaces,
a first plurality of integrated circuit chips mounted on said top surface of said substrate,
a second plurality of integrated circuit chips mounted on said bottom surface of said substrate,
a connector block mounted on said bottom surface of said substrate and connected to respective connection features of said planar board,
a generally rectangular top cold plate disposed parallel with said substrate in thermal communication with said first plurality of integrated circuit chips, said top cold plate having a conduit therein for receiving a circulating coolant, said conduit having first and second ends, and
a generally rectangular bottom heat dissipation plate disposed parallel with said substrate and located opposite said top cold plate with respect to said substrate in thermal communication with said second plurality of integrated circuit chips, said connector block passing through a connector cutout in said bottom heat dissipation plate, and a perimeter of said top cold plate being in direct thermal communication with a perimeter of said bottom heat dissipation plate;
a plurality of feeder pipes in fluid communication with the first ends of the conduits in the cold plates;
a plurality of collection pipes in fluid communication with the second ends of the conduits in the cold plates;
a supply manifold which branches out into said feeder pipes;
return manifold which branches out into said collection pipes;
a fluid inlet connected to said supply manifold;
and
a fluid outlet connected to said return manifold.

13 more elements

Dependencies are inferred from the claim text.

Compute intensive module packaging

Life of this patent

Compute intensive module packaging

Life of this patent

Abstract

Claims21