Back to results
US 2016/0079139 A1Published application
Semiconductor device
AssigneeRenesas Electronics Corporation
InventorShunichi KAERIYAMA
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes an AC coupling element, and a temperature monitoring unit that outputs a temperature monitor signal, the temperature monitoring unit has a first temperature monitoring element that outputs the temperature monitor signal, and the first temperature monitoring element is arranged in a region immediately below or a region adjacent to the AC coupling element.
Claims14
1-20. (canceled)
A semiconductor device, comprising:
- an AC coupling element that is formed on a semiconductor substrate;
- a temperature monitoring unit that outputs a temperature monitor signal in response to a change in a temperature of the semiconductor substrate;
- a heat generation determination unit that outputs a heat generation detection signal on the basis of the temperature monitor signal;
- a power supply pad that applies a supply voltage;
- and
- a transmitter circuit that is coupled to the AC coupling element,
- wherein the temperature monitoring unit includes a first temperature monitoring element that outputs the temperature monitor signal, and
- wherein the first temperature monitoring element is arranged in a region below or a region adjacent to the AC coupling element.
5 more elements
A semiconductor device, comprising:
- an AC coupling element that is formed on a semiconductor substrate;
- a temperature monitoring unit that outputs a temperature monitor signal in response to a change in a temperature of the semiconductor substrate;
- a heat generation determination unit that outputs a heat generation detection signal on the basis of the temperature monitor signal;
- a power supply pad that applies a supply voltage;
- and
- a receiver circuit that is connected to the AC coupling element,
- wherein the temperature monitoring unit includes a first temperature monitoring element that outputs the temperature monitor signal,
- wherein the first temperature monitoring element is arranged in a region below or a region adjacent to the AC coupling element,
- wherein the heat generation determination unit includes a comparator,
- wherein the comparator outputs the heat generation detection signal on the basis of a comparison result between a reference voltage and the temperature monitor signal, and
- wherein a resistance value of a power supply line between the power supply pad and the comparator is smaller than a resistance value between the power supply pad and the receiver circuit.
8 more elements
A semiconductor device, comprising:
- a temperature monitoring unit that includes a first temperature monitoring element formed on a semiconductor substrate;
- and
- an AC coupling element that includes a first element and a second element formed on the semiconductor substrate,
- wherein the first element and the second element are arranged to perform AC coupling, and
- wherein the first temperature monitoring element is arranged in a region below or in a region adjacent to a formation region of the AC coupling element,
- wherein the first element includes a first coil which is formed of a first wiring layer,
- wherein the second element includes a second coil which is formed of a second wiring layer different from the first wiring layer, and
- wherein the first temperature monitoring element formed in the region adjacent to the AC coupling element is covered with a shield layer formed of the lower wiring layer of the first wiring layer and the second wiring layer.
5 more elements
Dependencies are inferred from the claim text.