Electronic structures strengthened by porous and non-porous layers, and methods of fabrication
AssigneeInvensas Corporation
InventorsCyprian UZOH, Rajesh KATKAR
Life of this patent
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Abstract
Integrated circuits (ICs 110) are attached to a wafer (120W). A stabilization layer (404) is formed over the wafer to strengthen the structure for further processing. Unlike a conventional mold compound, the stabilization layer is separated from at least some wafer areas around the ICs by one or more gap regions (450) to reduce the thermo-mechanical stress on the wafer and hence the wafer warpage. Alternatively or in addition, the stabilization layer can be a porous material having a low horizontal elastic modulus to reduce the wafer warpage, but having a high flexural modulus to reduce warpage and otherwise strengthen the structure for further processing. Other features and advantages are also provided.
Claims29
A fabrication process comprising:
- (1) obtaining an assembly comprising:
- one or more first modules each of which comprises circuitry comprising one or more contact pads;
- a first structure comprising circuitry comprising one or more contact pads at a top side of the first structure;
- wherein the one or more contact pads of the one or more first modules are attached to the one or more contact pads of the first structure;
- and then
- (2) forming a first layer over the first structure, the first layer adhering to the one or more first modules and overlying one or more areas of a top surface of the first structure which are not covered by the one or more first modules, the first layer being separated from the one or more areas by one or more gap regions underlying the first layer.
A structure comprising:
- one or more first modules each of which comprises circuitry comprising one or more contact pads;
- a first structure comprising circuitry comprising one or more contact pads at a top side of the first structure;
- wherein the one or more contact pads of the one or more first modules are attached to the one or more contact pads of the first structure;
- and
- a first layer over the first structure, the first layer adhering to the one or more first modules and overlying one or more areas of a top surface of the first structure which are not covered by the one or more first modules, the first layer being separated from the one or more areas by one or more gap regions underlying the first layer.
A fabrication process comprising:
- (1) obtaining an assembly comprising:
- one or more first modules each of which comprises circuitry comprising one or more contact pads;
- a first structure comprising circuitry comprising one or more contact pads at a top side of the first structure;
- wherein the one or more first modules are attached to the top side of the first structure, wherein the one or more contact pads of the one or more first modules being attached to the one or more contact pads of the first structure;
- and then
- (2) forming a first layer over the first structure, the first layer adhering to the one or more first modules, the first layer being porous and extending substantially along a first plane, the first layer having a higher elastic modulus along the first plane than a flexural modulus in a direction perpendicular to the first plane.
A structure comprising:
- one or more first modules each of which comprises circuitry comprising one or more contact pads;
- a first structure comprising circuitry comprising one or more contact pads at a top side of the first structure;
- wherein the one or more first modules are attached to the top side of the first structure, the one or more contact pads of the one or more first modules being attached to the one or more contact pads of the first structure;
- and
- a first layer over the first structure, the first layer adhering to the one or more first modules, the first layer being porous and extending substantially along a first plane, the first layer having a higher elastic modulus along the first plane than a flexural modulus in a direction perpendicular to the first plane.
Dependencies are inferred from the claim text.