Printed circuit module having semiconductor device with a polymer substrate and methods of manufacturing the same
AssigneeRF Micro Devices, Inc.
InventorsDirk Robert Walter Leipold, Julio C. Costa, Baker Scott
Life of this patent
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Abstract
A printed circuit module and methods for manufacturing the same are disclosed. The printed circuit module includes a printed circuit substrate with a thinned die attached to the printed circuit substrate. The thinned die includes at least one device layer over the printed circuit substrate and a buried oxide (BOX) layer over the at least one device layer. A polymer layer is disposed over the BOX layer, wherein the polymer has a thermal conductivity greater than 2 watts per meter Kelvin (W/mK) and an electrical resistivity of greater than 103 Ohm-cm.
Claims28
A printed circuit module comprising:
- a printed circuit substrate;
- a thinned die attached to the printed circuit substrate and having at least one device layer over the printed circuit substrate and a buried oxide (BOX) layer over the at least one device layer;
- and
- a polymer layer over the BOX layer, wherein the polymer has a thermal conductivity greater than 2 watts per meter Kelvin (W/mK) and an electrical resistivity of greater than 103 Ohm-cm.
A method of making a printed circuit module comprising:
- providing a printed circuit substrate having a die attached to a top side of the printed circuit substrate, the die having at least one device layer over the printed circuit module, a buried oxide (BOX) layer over the at least one device layer and a handle layer over the BOX layer;
- disposing a first protective layer onto the printed circuit substrate directly against the die up to a plane that is substantially aligned with an interface between the handle layer and the BOX layer;
- disposing a second protective layer onto a bottom side of the printed circuit substrate;
- removing the handle layer from the die to provide a thinned die with the BOX layer exposed;
- and
- disposing a polymer layer over the BOX layer, wherein the polymer layer has a thermal conductivity greater than 2 watts per meter Kelvin (W/mK) and an electrical resistivity of greater than 103 Ohm-cm.
Dependencies are inferred from the claim text.