Package structure and fabrication method thereof

A package structure, comprising:

• a frame having a cavity penetrating therethrough;
• at least a semiconductor chip received in the cavity of the frame, wherein the semiconductor chip has opposite active and inactive surfaces exposed from the cavity of the frame;
• a dielectric layer formed in the cavity to contact and fix in position the semiconductor chip;
• a circuit structure formed on a surface of the dielectric layer toward which the active surface of the semiconductor chip faces and electrically connected to the active surface of the semiconductor chip;
• and
• a carrier disposed on the frame, the dielectric layer and the inactive surface of the semiconductor chip, wherein the frame and the carrier are not integrally formed.

A method for fabricating a package structure, comprising the steps of:

• forming a frame on a carrier and disposing at least a semiconductor chip on the carrier, wherein the carrier has opposite first and second surfaces, the frame is formed on the first surface of the carrier and has a cavity exposing a portion of the first surface of the carrier, the frame and the carrier are not integrally formed, the semiconductor chip is received in the cavity of the frame and disposed on the first surface of the carrier and has an inactive surface attached to the first surface of the carrier and an active surface opposite to the inactive surface, and a dielectric layer is filled in the cavity to contact and fix in position the semiconductor chip;
• forming a circuit structure on the dielectric layer, wherein the circuit structure is electrically connected to the active surface of the semiconductor chip;
• and
• removing the carrier to expose the inactive surface of the semiconductor chip.