Semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorsEitaro MIYAKE, Hideaki KITAZAWA
Life of this patent
Estimating the term…
Loading patent…
AssigneeKabushiki Kaisha Toshiba
InventorsEitaro MIYAKE, Hideaki KITAZAWA
Estimating the term…
A semiconductor device includes a semiconductor chip comprising a first and second terminal surfaces. An insulator surrounds an outer circumference of a side surface of the chip. A reinforcing-member is arranged between the side surface of the chip and an inner side surface of the insulator and surrounds the outer circumference of the side surface of the chip. A first and second holders hold the reinforcing-member therebetween at a top and bottom surfaces of the reinforcing-member. The first and second holders comprise protrusions facing an inner wall surface of the reinforcing-member, and the when φ1in represents an inner-diameter of parts of the reinforcing-member opposing to the protrusions, φ1out represents an outer-diameter of the reinforcing-member, φ2 represents an outer-diameter of the protrusion of either the first or the second holder, and φ3 represents an inner diameter of the insulator, the following Expression 1 is satisfied φ1in−φ2<φ3-φ1out.
A semiconductor device comprising:
A semiconductor device comprising:
Dependencies are inferred from the claim text.