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US 2016/0079133 A1Published application
Semiconductor device
AssigneeFuji Electric Co., Ltd.
InventorsNorihiro NASHIDA, Yoko NAKAMURA
Life of this patent
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Abstract
A semiconductor device includes an insulating substrate having a circuit plate on a principal surface thereof; a semiconductor element fixed to the circuit plate; an external terminal having one end fixed to the circuit plate; and a printed circuit board facing the principal surface of the insulating substrate, and having a through-hole for passing through the external terminal. A rigidity of a peripheral region of the through-hole is lower than a rigidity of other regions.
Claims8
A semiconductor device comprising:
- an insulating substrate having a circuit plate on a principal surface thereof;
- a semiconductor element fixed to the circuit plate;
- an external terminal having one end fixed to the circuit plate;
- and
- a printed circuit board facing the principal surface of the insulating substrate, and having a through-hole for passing through the external terminal, wherein a rigidity of a peripheral region of the through-hole is lower than a rigidity of other regions.
2 more elements
Dependencies are inferred from the claim text.