Manufacturing method of semiconductor device

Abstract

A method for manufacturing a semiconductor device includes preparing a structure including a semiconductor substrate having a plurality of semiconductor elements thereon, a cover layer covering the semiconductor elements, a supporting substrate, and an adhesive layer between the first adhesive layer and the supporting substrate, removing side edge portions of the semiconductor substrate and the adhesive layer, such that a side surface of the cover layer is exposed, forming, in the supporting substrate, fragile portions, the fragile portions extending in a first direction, attaching an adhesive sheet on a surface of the supporting substrate that is opposite to a surface that is in contact with the adhesive layer, and pulling on the adhesive sheet in a second direction different from the first direction, to peel off the supporting substrate and the adhesive layer from the semiconductor substrate having the semiconductor elements.

Dependencies are inferred from the claim text.