Sacrificial Carrier Dicing of Semiconductor Wafers
AssigneeInternational Business Machines Corporation
InventorsRichard S. Graf, Douglas O. Powell, David J. Russell, David J. West
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Abstract
Mechanisms are provided for sacrificial carrier dicing of semiconductor wafers. A bottom layer of a semiconductor wafer is bonded to a top layer of a sacrificial carrier. The semiconductor wafer is diced into a set of chips, such that the dicing cuts through the semiconductor wafer and into the sacrificial carrier and such that the sacrificial carrier dresses a diamond blade of a saw so as to expose one or more new, sharp layers of diamonds on the diamond blade.
Claims20
1-11. (canceled)
A sacrificial carrier dicing structure, the sacrificial carrier dicing structure comprising:
- a bottom layer of a semiconductor wafer bonded to a top layer of the sacrificial carrier using adhesive film;
- and
- the bottom layer of the sacrificial carrier bonded to clear dicing tape, wherein the clear dicing tape securely bonds the sacrificial carrier to a cutting surface of the saw for dicing of the semiconductor wafer into the set of chips, and wherein the semiconductor wafer is diced into the set of chips by dicing through the semiconductor wafer and the adhesive film and into the sacrificial carrier.
An apparatus for sacrificial carrier dicing of semiconductor wafers, the apparatus comprising:
- a saw;
- and
- a diamond blade mounted in the saw, wherein the diamond blade dices a bonded structure comprising a bottom layer of a semiconductor wafer coupled to a top layer of a sacrificial carrier, wherein the semiconductor wafer is diced into a set of chips by dicing through the semiconductor wafer and into the sacrificial carrier, and wherein the sacrificial carrier dresses the diamond blade of the saw so as to expose one or more new, sharp layers of diamonds on the diamond blade.
Dependencies are inferred from the claim text.