Manufacturing apparatus of semiconductor device, and manufacturing method of semiconductor device

A manufacturing method, comprising:

• placing a first tape section and a second tape section in a facing arrangement, the first tape section having a first semiconductor chip disposed thereon;
• forming an enclosed space by using a ring element disposed between the first and second tape sections and bringing the first and second tape sections into contact with the ring element, the first semiconductor chip being within the enclosed space thus formed;
• lowering a pressure within the enclosed space by evacuating the enclosed space via a fluid passage in the ring element, the lowering of the pressure causing the second tape section to come into contact with the first semiconductor chip disposed on the first tape section;
• setting an adhesive force of the second tape section towards the first semiconductor chip to be greater than an adhesive force of the first tape section towards the first semiconductor chip;
• and
• increasing the pressure within the enclosed space by venting the enclosed space via the fluid passage in the ring element, the increasing of the pressure causing the second tape section to separate from the first tape section, the first semiconductor chip being adhered to second tape section and separated from the first tape section.

A method, comprising:

• placing a first semiconductor chip on a first surface of a first tape section;
• supporting the first tape section on a first supporting section, the first surface of the first tape section facing away from the first supporting section;
• supporting a second tape section on a second supporting section, the second tape section having a second surface facing away from the second supporting section;
• placing the first and second tape sections in a facing arrangement with the first tape section supported on the first supporting section and the second tape section supported on the second supporting section;
• positioning a ring element between the first and second supporting sections while the first and second tape sections are placed in the facing arrangement, the ring element being disposed at periphery of a space that is between the first and second tape sections, the ring element having a port allowing fluid communication between the space and an outlet port;
• lowering a pressure of the space by evacuating the space through the port, the lowering of the pressure causing the second tape section contact and adhere to the first semiconductor chip disposed on the first tape section;
• and
• increasing the pressure of the space by venting the space through the port, the increasing of the pressure causing the first semiconductor chip and the first tape section to separate from each other.