Sacrificial Carrier Dicing of Semiconductor Wafers
AssigneeInternational Business Machines Corporation
InventorsRichard S. Graf, Douglas O. Powell, David J. Russell, David J. West
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Abstract
Mechanisms are provided for sacrificial carrier dicing of semiconductor wafers. A bottom layer of a semiconductor wafer is bonded to a top layer of a sacrificial carrier. The semiconductor wafer is diced into a set of chips, such that the dicing cuts through the semiconductor wafer and into the sacrificial carrier and such that the sacrificial carrier dresses a diamond blade of a saw so as to expose one or more new, sharp layers of diamonds on the diamond blade.
Claims12
A method for sacrificial carrier dicing of semiconductor wafers, the method comprising:
- bonding a bottom layer of a semiconductor wafer to a top layer of a sacrificial carrier;
- and
- dicing the semiconductor wafer into a set of chips, whereas the dicing cuts through the semiconductor wafer and into the sacrificial carrier, and wherein the sacrificial carrier dresses a diamond blade of a saw so as to expose one or more new, sharp layers of diamonds on the diamond blade.
12-20. (canceled)
Dependencies are inferred from the claim text.