Method and apparatus for manufacturing semiconductor devices

A method of manufacturing a semiconductor device on a first substrate having a first surface and second surface, comprising:

• disposing a peel-off layer on the second surface of the first substrate, wherein the second surface of the first substrate comprises semiconductor integrated circuits, and the peel-off layer does not extend to an outer peripheral portion of the first substrate;
• bonding a second substrate to the peel-off layer via a bonding layer;
• attaching a tape onto the first surface of the first substrate, wherein the tape comprises an adhesive agent having an adhesive strength capable of being lowered by UV irradiation;
• irradiating a portion of the adhesive agent provided at the outer peripheral portion with UV rays directed toward the first surface;
• and
• separating the first substrate from the second substrate at the adhesive agent portion and the peel-off layer portion.