Transport module for a semiconductor fabrication device or coupling device

A transport module (2) for purposes of loading and unloading a process module (1) of a semiconductor production device, with a housing (3), which has a chamber (4) that can be evacuated, which has an opening (6) that can be closed in a gas-tight manner by a closure device (5), which opening opens out into a coupling duct (7) associated with the transport module (2), which coupling duct is connected with a flange plate (9) using an elastically deformable element (8), wherein the flange plate (9) can be seated in a plane parallel, sealing manner on a flange plate (11) of a coupling duct (10) associated with the process module (1), so that after opening the closure device (5) an evacuated loading and unloading duct to the process module (1) is created, wherein a mounting section of the sealing element (8) is connected with the flange plate (9), and another mounting section of the sealing element (8) is connected with the wall (12, 12′) of the coupling duct (7), wherein the mounting sections are spaced apart from one another in the radial direction, with respect to the axis of the coupling duct, by the sealing element, characterised in that, a peripheral rib (19) is formed by a holding frame (13, 15), which presses into the surface of the sealing element (8), wherein the holding frame (13) features a projection (22), which, located against a seating face (23), defines the clearance width of a clearance space, in which the sealing element (8) and the peripheral rib (19) are located.