Single or multi chip module package and related methods

A method of forming a semiconductor device package, consisting essentially of:

• contacting a plurality of electrical contacts on a first face of a first die with an adhesive surface of an adhesive tape;
• one of overmolding and encapsulating the first die with one of a mold compound and an encapsulating compound, respectively, wherein a portion of the plurality of electrical contacts on the first face of the first die are not one of overmolded and encapsulated, forming the semiconductor device package;
• and
• removing the semiconductor device package from the adhesive surface;
• wherein the portion of the plurality of electrical contacts on the first face of the first die are positioned to electrically couple with one or more conductive paths comprised in a motherboard, the one or more conductive paths forming a distribution layer;
• and
• wherein the distribution layer is configured to distribute all electrical signals between the semiconductor device package and the motherboard.

A method of forming a semiconductor device package, comprising:

• contacting a plurality of electrical contacts on a first face of one of a first die and a passive component with an adhesive surface of an adhesive tape;
• one of overmolding and encapsulating one of the first die and passive component with one of a mold compound and an encapsulating compound, respectively, wherein a portion of the plurality of electrical contacts on the first face of one of the first die and passive component are not one of overmolded and encapsulated, forming the semiconductor device package, the semiconductor device package comprising no leadframe;
• and
• removing the semiconductor device package from the adhesive surface;
• wherein the portion of the plurality of electrical contacts on the first face of one of the first die and passive component are positioned to electrically couple with one or more conductive paths comprised in a motherboard, the one or more conductive paths forming a distribution layer;
• and
• wherein the distribution layer is configured to distribute all electrical signals between the semiconductor device package and the motherboard.

A method of manufacturing a semiconductor device package, consisting essentially of:

• contacting a plurality of electrical contacts on a first face of a die with an adhesive surface of an adhesive tape;
• electrically and mechanically coupling at least one clip with at least one electrical contact on a second face of the die, the second face of the die on an opposing side of the die from the first face of the die, the at least one clip comprising at least one lead in electrical communication with the at least one electrical contact on the second face of the die;
• contacting the at least one lead with the adhesive surface;
• one of overmolding and encapsulating the die and a majority of the at least one clip with one of a mold compound and an encapsulating compound, respectively, wherein a portion of the at least one lead and a portion of the plurality of electrical contacts on the first face of the die are not one of overmolded and encapsulated, forming the semiconductor device package;
• and
• removing the semiconductor device package from the adhesive surface.