Power device having reduced thickness
AssigneeSTMicroelectronics S.r.l.
InventorsAgatino Minotti, Cristiano Gianluca Stella
Life of this patent
Estimating the term…
Abstract
An electronic device includes at least one chip and an insulating body embedding the chip. The electronic device further includes a heat-sink in contact with the chip. The heat-sink includes a plate having a first thickness. A recess is provided in the plate that defines a central portion of the plate having a second thickness less than the first thickness. The chip is mounted to the central region of the heat-sink within the recess. The insulating body includes a surface, such as a mounting surface, including an opening exposing at least a portion of the heat-sink. The device may further include a reophore extending through a side surface of the insulating body, that reophore being in contact with the heat sink.
Claims12
A method for making an electronic device, comprising:
- forming a first recess in a first heat sink, said first recess peripherally surrounded by a side wall defining a first recess depth and having a first mounting surface at a bottom of the first recess having a mounting area;
- providing an electronic component integrated within a chip, the chip comprising a first conduction terminal on a first surface of the chip;
- and
- attaching the first surface of the chip to the first mounting surface of the first heat sink.
A method for making an electronic device, comprising:
- providing an electronic component integrated within at least one chip, the at least one chip comprising a first conduction terminal on a first surface of the chip, and a second conduction terminal and a third conduction terminal on a second surface of the chip opposite said first surface,
- embedding said at least one chip within an insulating body, the insulating body having a mounting surface configured to mount on a board,
- providing a first heat-sink in contact with the first conduction terminal of said at least one chip for dissipating the heat generated by said at least one electronic component towards the mounting surface, the first heat-sink including a plate having a first thickness, the plate further provided with a first recess that defines a portion of the plate with a second thickness lower than the first thickness,
- providing a second heat-sink for dissipating the heat generated by said at least one electronic component towards a free surface of the insulating body opposite the mounting surface, the second heat-sink comprising a second recess,
- housing said at least one chip within said first recess, and
- contacting the second heat-sink to the second conduction terminal, the second recess of the second heat-sink extending over at least one portion of the third conduction terminal for insulating the third conduction terminal from the second heat-sink.
Dependencies are inferred from the claim text.