Carrier-less silicon interposer
AssigneeInvensas Corporation
InventorsMichael Newman, Cyprian Uzoh, Charles G. Woychik, Pezhman Monadgemi, Terrence Caskey
Life of this patent
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Abstract
An interposer has conductive elements at a first side and terminals at a second side opposite therefrom, for connecting with a microelectronic element and a second component, respectively. The component includes a first element having a thermal expansion coefficient less than 10 ppm/° C., and an insulating second element, with a plurality of openings extending from the second side through the second element towards the first element. A conductive structure extending through the openings in the second element and through the first element electrically connects the terminals with the conductive elements.
Claims8
A method of fabricating an interposer, comprising:
- providing an insulating second element overlying a surface of a first element, the first element consisting essentially of a material having a CTE of less than 10 ppm/° C., the first element having a first thickness in a first direction normal to the surface, wherein openings extend in the first direction through the second element;
- abrading the first element to produce a thinned first element having a second thickness less than the first thickness;
- forming conductive elements at a first side of the interposer coincident with or adjacent to a surface of the thinned first element remote from the second element, and conductive structure extending through the openings in the second element, wherein the conductive elements are electrically connected with terminals of the interposer through the conductive structure, the terminals disposed at a second side of the interposer opposite from the first side.
Dependencies are inferred from the claim text.