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US 2016/0079087 A1Published application
Method of processing a semiconductor device and chip package
AssigneeInfineon Technologies AG
InventorsSRINIVASA REDDY YEDURU, JOACHIM HIRSCHLER, HARALD WIEDENHOFER, FRANZ KLEINBICHLER
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Abstract
In various embodiments, a method of processing a semiconductor device may include providing a semiconductor device comprising a contact pad and a polymer layer; and subjecting at least a part of the contact pad and the polymer layer to a plasma comprising ammonia.
Claims16
A method of processing a semiconductor device, the method comprising:
- providing a semiconductor device comprising a contact pad and a polymer layer;
- and
- subjecting at least a part of the contact pad and of the polymer layer to a plasma comprising ammonia.
A method of processing a semiconductor device, the method comprising:
- providing a semiconductor device comprising a contact pad comprising at least one of aluminum, copper, an aluminum alloy and a copper alloy, and a polymer layer comprising polyimide;
- subjecting at least a part of the contact pad and the polymer layer to a plasma comprising ammonia.
The method of claim 15,
- wherein the plasma further comprises oxygen or hydrogen.
A chip package, comprising:
- a chip;
- a contact pad arranged over the chip;
- a polymer layer arranged over the chip, wherein a surface of the polymer layer has a surface roughness of between 10 nm and 200 nm;
- and
- a chip packaging material disposed over the surface of the polymer layer;
- wherein an atomic concentration of a halogen in a surface layer of the contact pad is equal to or below 5%.
3 more elements
Dependencies are inferred from the claim text.