Method of forming a semiconductor device and according semiconductor device
AssigneeGlobalfoundries Inc.
InventorsDominic Thurmer, Hans-Juergen Thees, Kai Frohberg, Peter Moll, Heike Scholz
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AssigneeGlobalfoundries Inc.
InventorsDominic Thurmer, Hans-Juergen Thees, Kai Frohberg, Peter Moll, Heike Scholz
Estimating the term…
The present disclosure provides a method of forming a semiconductor device, including a shaping of a gate structure of the semiconductor device such that a spacer removal after silicide formation is avoided and silicide overhang is suppressed. In some aspects of the present disclosure, a method of forming a semiconductor device is provided wherein a gate structure is provided over an active region of a semiconductor substrate, the gate structure including a gate electrode material and sidewall spacers. At least one of the gate electrode material and the sidewall spacers are shaped by applying a shaping process to the gate structure and a silicide portion is formed on the shaped gate structure.
A method of forming a semiconductor device, comprising:
A method of forming a semiconductor device, comprising:
A semiconductor device, comprising:
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Dependencies are inferred from the claim text.