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US 2016/0079083 A1Published application
Semiconductor manufacturing apparatus and semiconductor manufacturing method
AssigneeKabushiki Kaisha Toshiba
InventorsMari KUSUNOKI, Shinji MIYAZAKI
Life of this patent
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Abstract
According to an embodiment, a semiconductor manufacturing apparatus includes a chamber, a process tube, a substrate supporting portion, a heater, and a reflection plate. The heater is provided under the substrate supporting portion, and heats the substrates. The reflection plate is provided at a lower side of the heater, and reflects heat emitted from the heater upward.
Claims20
A semiconductor manufacturing apparatus comprising:
- a chamber;
- a process tube that is provided in the chamber, and into which reactant gas is introduced;
- a substrate supporting portion that is provided in the process tube, and horizontally supports a plurality of substrates in multilayers;
- a heater that is provided under the substrate supporting portion, and heats the substrates;
- and
- a reflection plate that is provided at a lower side of the heater, and reflects heat emitted from the heater upward.
3 more elements
A semiconductor manufacturing apparatus comprising:
- a chamber;
- a process tube that is provided in the chamber, and into which reactant gas is introduced;
- a substrate supporting portion that is provided in the process tube, and horizontally supports a plurality of substrates in multilayers;
- a first heater that is provided between the process tube and the chamber, and heats the substrates;
- a second heater that is provided under the substrate supporting portion, and heats the substrates;
- and
- a reflection plate that is provided at a lower side of the second heater, and reflects heat emitted from the second heater upward.
4 more elements
A semiconductor manufacturing method comprising:
- introducing reactant gas to a process tube provided in a chamber;
- horizontally supporting a plurality of substrates in multilayers on a substrate supporting portion in the process tube;
- heating the substrates by a heater provided under the substrate supporting portion;
- and
- reflecting heat emitted from the heater upward by a reflection plate provided at a lower side of the heater.
2 more elements
Dependencies are inferred from the claim text.