Manufacturing Method of Metal Oxide Semiconductor Transistor

Abstract

A manufacturing method of MOS transistor, the MOS transistor includes a substrate, a gate oxide, a gate, a source/drain region and a silicide layer. The gate oxide is disposed on the substrate and the gate is disposed on the gate oxide. The source/drain region is disposed in the substrate at two sides of the gate. The silicide layer is disposed on the source/drain region, wherein the silicide layer includes a curved bottom surface and a curved top surface, both the curved top surface and the curved bottom surface bend toward the substrate and the curved top surface is sunken from two sides thereof, two ends of the silicide layer point tips raised up over the source/drain region and the silicide layer in the middle is thicker than the silicide layer in the peripheral, thereby forming a crescent structure. The present invention further provides a manufacturing method of the MOS transistor.

Dependencies are inferred from the claim text.