Back to results
US 2016/0079065 A1Published application
Laser annealing device and method
AssigneeSemiconductor Manufacturing International (Shanghai) Corporation
InventorBoXiu CAI
Life of this patent
Estimating the term…
Abstract
A laser annealing device for compensating wafer heat maps and its method are disclosed. A laser annealing device comprises a pump laser source array including of a plurality of pump laser sources for irradiating a tunable mask, each pump laser source emitting pump laser, an annealing laser source for emitting annealing laser and irradiating the tunable mask, and a tunable mask for transmitting at least part of the annealing laser after being irradiated by the pump laser.
Claims9
A method of performing laser annealing on a wafer, comprising:
- irradiating a tunable mask with pump lasers emitted from a plurality of pump laser sources which composed of a pump laser source array;
- irradiating the tunable mask with an annealing laser emitted from an annealing laser source,
- wherein the tunable mask becomes transmissive to at least part of the annealing laser after being irradiated by the pump laser.
Dependencies are inferred from the claim text.