Circuit protection device and method of manufacturing same
AssigneeInnochips Technology Co., Ltd.
InventorsIn Kil PARK, Tae Hyung NOH, Jun Ho JUNG, Gyeong Tae KIM, Seung Hun CHO, Young Tak KIM, Jong Pil PARK
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Abstract
Provided is a circuit protection device and a method of manufacturing the same including forming a plating lead line and a first coil pattern connected to the plating lead line on a substrate, forming an insulating layer on the first coil pattern and then forming a via hole exposing a portion of the first coil pattern, applying power through a plating lead line to form a via plug filling the via hole from the first coil pattern, and forming a second coil pattern connected to the via plug at an upper portion of the insulating layer.
Claims11
A method of manufacturing a circuit protection device, the method comprising:
- forming a plating lead line and a first coil pattern connected to the plating lead line on a substrate;
- forming an insulating layer on the first coil pattern and then forming a via hole exposing a portion of the first coil pattern;
- applying power through the plating lead line to form a via plug filling the via hole from the first coil pattern;
- and
- forming a second coil pattern connected to the via plug on the insulating layer.
A circuit protection device comprising:
- a plurality of coil patterns stacked on a substrate in a vertical direction;
- a plurality of insulating layers each formed between the plurality of coil patterns and insulating the plurality of coil patterns;
- a plurality of via plugs formed in the plurality of insulating layers and connecting the plurality of coil patterns to each other;
- and
- a dummy pattern formed in at least one coil pattern,
- wherein the via plugs are formed by filling a via hole provided in the insulating layer from the coil pattern of a lower layer by applying power through a plating lead line connected to at least one of the coil patterns.
Dependencies are inferred from the claim text.